ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,317, issued on Sept. 29, was assigned to WUXI LEAPERS SEMICONDUCTOR Co. LTD. (Wuxi, China). "Power semiconductor module" was invented by X... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,318, issued on Sept. 29, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Daisuke Inoue (M... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,319, issued on Sept. 29, was assigned to LG Electronics Inc. (Seoul, South Korea) and LG DISPLAY Co. LTD. (Seoul, South Korea). "Display a... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,320, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Chip-on-wafer-on-board structure ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,321, issued on Sept. 29, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manu... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,322, issued on Sept. 29, was assigned to Xiamen Tianma Microelectronics Co. Ltd. (Xiamen, China). "Display panel and display device" was i... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,323, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct bonding methods and str... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,324, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package manufactured through... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,325, issued on Sept. 29, was assigned to Jiangxi MTC Visual Display Co. Ltd (Nanchang, China). "Data and scanning lines pattern of an LED ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,326, issued on Sept. 29, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Stacked chip scale semiconductor device" was inven... Read More